Devcon 5 Minute® Epoxy specifications

Devcon 5 Minute® Epoxy

Description: A rapid-curing, general purpose adhesive/encapsulant.
Intended Use: Bonds metals, fabrics, ceramics, glass, wood, and concrete (in combinations)
Product features:

  • 100% reactive, no solvents.
  • Good solvent resistance.
  • Bonds metals, fabrics, glass, wood, and concrete.

Limitations: None
Typical Physical Properties: Technical data should be considered representative or typical only and should not be used for specification purposes.

Cured (7 days at 75 deg F)
T-Peel 2-3 Pli
Tensile Elongation 1%
Shore Hardness 85 shore D
Gap-fill Good
Dielectric Strength 490 vol/mils
% Solids by Volume 100
Adhesive Tensile Lap  
Shear (GBS) 1,900 psi @ 0.005 inches bondline
Specific Volume 25.1 in3/lb

Tests Conducted
Dialectric Strength: volts/mil ASTM D149
Cured Hardness:
Shore D ASTM D 2240
Cured Density:
ASTM D 792

Uncured
Color Light Amber
Mixed Viscosity 10,000 cps
Mix Ratio by Volume 1:1
Mix Ratio by Weight 1:1
Mixed Density 9.17 lbs
Working Time 3-6 min (28 gm @ 72 deg F)
Fixture Time 10-15 min @ 72 deg F
Functional Time 3/4-1 hour @ 72 deg F
Full Cure 12 hours
Service Temperature Dry, -40 deg F to 200 deg F


Surface Preparation:
Clean surface by solvent-wiping any deposits of heavy grease, oil, dirt, or other contaminants. Surface can also be cleaned with industrial cleaning equipment such as vapor phase degreasers or hot aqueous baths. If working with metal, abrade or roughen the surface to significantly increase the microscopic bond area and increase the bond strength.

Mixing Instructions:
Proper homogenous mixing of resin and hardener is essential for the curing and development of stated strengths.
25 ML Dev-Tube
1. Squeeze material into a small container the size of an ashtray.
2. Using mixing stick included on Dev-Tube handle, vigorously mix components for one (1) minute.
3. Immediately apply to substrate.

Application Instructions:

1. Apply mixed epoxy directly to one surface in an even film or as a bead.
2. Assemble with mating part within recommended working time.
3. Apply firm pressure between mating parts to minimize any gap and ensure good contact (a small fillet of epoxy should flow out the edges to display adequate gap fill.)

For very large gaps:
1. Apply epoxy to both surfaces
2. Spread to cover entire area OR make a bead pattern to allow flow throughout the joint
Let bonded assemblies stand for recommended functional cure time prior to handling.

Capabilities:
Can withstand processing forces
Do not drop, shock load, or heavily load

Storage:
Store in a cool, dry place.

Compliances: None

Chemical Resistance: (Chemical resistance is calculated with a 7 day, room temp. cure (30 days immersion) @ 75°F)

Chemical Resistance
Acetic (Dilute) 10% Poor
Acetone Poor
Ammonia Poor
Corn Oil Excellent
Cutting Oil Excellent
Ethanol Poor
Gasoline (Unleaded) Excellent
Glycols/Antifreeze Fair
Hydrochloric 10% Poor
Isopropanol Poor
Kerosene Excellent
Methyl Ethyl Ketone Poor
Mineral Spirits Excellent
Motor Oil Excellent
Sodium Hydroxide 10% Poor
Sulfuric 10% Poor


Precautions: Please refer to the appropriate material safety data sheet (MSDS) prior to using this product.

For technical assistance, please call 1-800-933-8266 FOR INDUSTRIAL USE ONLY

Warranty: Devcon ® will replace any material found to be defective. Because the storage, handling and application of this material is beyond our control, we can accept no liability for the results obtained.

Disclaimer: All information on this data sheet is based on laboratory testing and is not intended for design purposes. ITW Devcon ® makes no representations or warranties of any kind concerning this data.

Article Title:
Devcon 5 Minute® Epoxy specifications
Article Summary:
Information on how to use the Devcon 5 Minute® Epoxy.
Article Date:
6/9/2008
Article ID:
459
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