Devcon 5 Minute® Epoxy
Description: A rapid-curing, general purpose adhesive/encapsulant.
Intended Use: Bonds metals, fabrics, ceramics, glass, wood, and concrete (in combinations)
- 100% reactive, no solvents.
- Good solvent resistance.
- Bonds metals, fabrics, glass, wood, and concrete.
Typical Physical Properties: Technical data should be considered representative or typical only and should not be used for specification purposes.
|Cured (7 days at 75 deg F)|
||85 shore D|
|% Solids by Volume
|Adhesive Tensile Lap
||1,900 psi @ 0.005 inches bondline|
|Dialectric Strength: volts/mil ASTM D149|
|Cured Hardness: |
Shore D ASTM D 2240
|Cured Density: |
ASTM D 792
|Mix Ratio by Volume
|Mix Ratio by Weight
||3-6 min (28 gm @ 72 deg F)|
||10-15 min @ 72 deg F|
||3/4-1 hour @ 72 deg F|
||Dry, -40 deg F to 200 deg F|
Surface Preparation: Clean surface by solvent-wiping any deposits of heavy grease, oil, dirt, or other contaminants. Surface can also be cleaned with industrial cleaning equipment such as vapor phase degreasers or hot aqueous baths. If working with metal, abrade or roughen the surface to significantly increase the microscopic bond area and increase the bond strength.
Mixing Instructions: Proper homogenous mixing of resin and hardener is essential for the curing and development of stated strengths.
25 ML Dev-Tube
1. Squeeze material into a small container the size of an ashtray.
2. Using mixing stick included on Dev-Tube handle, vigorously mix components for one (1) minute.
3. Immediately apply to substrate.
1. Apply mixed epoxy directly to one surface in an even film or as a bead.
2. Assemble with mating part within recommended working time.
3. Apply firm pressure between mating parts to minimize any gap and ensure good contact (a small fillet of epoxy should flow out the edges to display adequate gap fill.)
For very large gaps:
1. Apply epoxy to both surfaces
2. Spread to cover entire area OR make a bead pattern to allow flow throughout the joint
Let bonded assemblies stand for recommended functional cure time prior to handling.
Capabilities: Can withstand processing forces
Do not drop, shock load, or heavily load
Storage: Store in a cool, dry place.
Chemical Resistance: (Chemical resistance is calculated with a 7 day, room temp. cure (30 days immersion) @ 75°F)
|Acetic (Dilute) 10%
|Methyl Ethyl Ketone
|Sodium Hydroxide 10%
Precautions: Please refer to the appropriate material safety data sheet (MSDS) prior to using this product.
For technical assistance, please call 1-800-933-8266 FOR INDUSTRIAL USE ONLY
Warranty: Devcon ® will replace any material found to be defective. Because the storage, handling and application of this material is beyond our control, we can accept no liability for the results obtained.
Disclaimer: All information on this data sheet is based on laboratory testing and is not intended for design purposes. ITW Devcon ® makes no representations or warranties of any kind concerning this data.
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